Bokhoni bo khanyang ba boteboLeseli la UVe khethoa haholo ke ts'ebetso ea kantle ea quantum, e anngoeng ke ts'ebetso ea ka hare ea quantum le katleho ea ho ntša leseli.Ka ntlafatso e tsoelang pele (> 80%) ea katleho ea ka hare ea mahlaseli a mahlaseli a mahlaseli a kotsi a mahlaseli a kotsi a mahlaseli a kotsi a mahlaseli a kotsi a mahlaseli a kotsi a matla a mahlaseli a mahlaseli a mahlaseli a mahlaseli a kotsi e fetohile ntho e ka sehloohong e thibelang ntlafatso ea khanya ea mahlaseli a mahlaseli a mahlaseli a kotsi a mahlaseli a kotsi a mahlaseli a kotsi, hammoho le ts'ebetso e ntle ea ho ntša leseli le khanyang. LED e tebileng ea UV e anngoe haholo ke theknoloji ea ho paka.Theknoloji e tebileng ea liphutheloana tsa UV LED e fapane le theknoloji ea hona joale e tšoeu ea liphutheloana tsa LED.LED e tšoeu haholo-holo e phuthetsoe ka lisebelisoa tsa tlhaho (epoxy resin, silica gel, joalo-joalo), empa ka lebaka la bolelele ba leqhubu le tebileng la mahlaseli a UV le matla a phahameng, lisebelisoa tsa tlhaho li tla senyeha tlas'a mahlaseli a nako e telele a mahlaseli a kotsi a UV, a amang haholo. matla a khanya le ho ts'epahala ha leseli la UV le tebileng.Ka hona, sephutheloana se tebileng sa UV LED se bohlokoa haholo bakeng sa khetho ea lisebelisoa.

Lisebelisoa tsa ho paka tsa LED haholo-holo li kenyelletsa lisebelisoa tse ntšang leseli, lisebelisoa tsa substrate tse futhumatsang mocheso le lisebelisoa tsa ho kopanya tjheseletsa.Thepa e ntšang leseli e sebelisoa bakeng sa ho ntšoa ha chip luminescence, taolo ea leseli, ts'ireletso ea mochini, joalo-joalo;Substrate ea ho senya mocheso e sebelisetsoa ho kopanya motlakase oa chip, ho senya mocheso le tšehetso ea mechine;Lisebelisoa tsa li-welding bonding li sebelisetsoa ho tiisa chip, ho kopanya lense, joalo-joalo.

1. lisebelisoa tse ntšang leseli:theLeseli la LEDSebopeho se hlahisang lintho ka kakaretso se amohela lisebelisoa tse pepeneneng ho hlokomela tlhahiso le phetoho, ha se ntse se sireletsa chip le lera la potoloho.Ka lebaka la ho hanyetsa mocheso o fokolang le mocheso o tlase oa mocheso oa thepa ea manyolo, mocheso o hlahisoang ke chip ea LED e tebileng ea UV e tla etsa hore mocheso oa motsoako oa liphutheloana o phahame, 'me lisebelisoa tsa manyolo li tla senyeha, ho tsofala ha mocheso esita le carbonization e ke keng ea fetoloa. tlas'a mocheso o phahameng ka nako e telele;Ho feta moo, tlas'a mahlaseli a kotsi a matla a ultraviolet, lesela la liphutheloana tsa lintho tse phelang le tla ba le liphetoho tse ke keng tsa fetoloa tse kang ho fokotseha ha transmittance le microcracks.Ka keketseho e tsoelang pele ea matla a tebileng a UV, mathata ana e ba a tebileng le ho feta, a etsa hore ho be thata bakeng sa lisebelisoa tsa setso tsa tlhaho ho fihlela litlhoko tsa liphutheloana tse tebileng tsa UV LED.Ka kakaretso, leha ho tlalehiloe hore lisebelisoa tse ling tsa manyolo li khona ho mamella leseli la ultraviolet, ka lebaka la ho se tsitse ha mocheso le ho se kenelle moea oa thepa ea manyolo, lisebelisoa tsa manyolo li ntse li lekanyelitsoe ho UV e tebileng.Sephutheloana sa LED.Ka hona, bafuputsi ba lula ba leka ho sebelisa lisebelisoa tse bonaletsang tsa inorganic joalo ka khalase ea quartz le safire ho paka mabone a tebileng a UV.

2. lisebelisoa tsa substrate tse senyang mocheso:hajoale, lisebelisoa tsa substrate tsa mocheso oa LED haholo li kenyelletsa resin, tšepe le ceramic.Ka bobeli resin le tšepe substrates li na le organic resin insulation layer, e leng ho tla fokotsa conductivity ea mocheso oa substrate dissipation le ho ama mocheso dissipation tshebetso ya substrate;Li-substrates tsa ceramic haholo-holo li kenyelletsa li-substrates tsa ceramic tse phahameng / tse tlase (HTCC /ltcc), li-ceramic substrates tse teteaneng (TPC), li-copper-clad ceramic substrates (DBC) le electroplated ceramic substrates (DPC).Li-ceramic substrates li na le melemo e mengata, joalo ka matla a phahameng a mochine, ho kenya letsoho hantle, mocheso o phahameng oa mocheso, mocheso o motle oa ho hanyetsa mocheso, coefficient e tlase ea ho atolosa mocheso joalo-joalo.Li sebelisoa haholo ho paka lisebelisoa tsa matla, haholo-holo liphutheloana tsa LED tse nang le matla a phahameng.Ka lebaka la khanya e tlase ea khanya ea UV LED, boholo ba matla a motlakase a kenang a fetoloa mocheso.E le ho qoba tšenyo e phahameng ea mocheso ho chip e bakoang ke mocheso o feteletseng, mocheso o hlahisoang ke chip o hloka ho qhalloa tikolohong e potolohileng ka nako.Leha ho le joalo, leseli le tebileng la UV LED haholo-holo le itšetlehile ka karolo ea mocheso ea mocheso e le tsela ea ho tsamaisa mocheso.Ka hona, substrate ea ceramic e nang le mocheso o phahameng oa mocheso ke khetho e ntle bakeng sa substrate ea ho qhala mocheso bakeng sa sephutheloana se tebileng sa UV LED.

3. lisebelisuoa tsa li-welding bonding:Thepa e tebileng ea li-welding tsa UV ea LED e kenyelletsa lisebelisoa tse tiileng tsa kristale le lisebelisoa tsa welding tsa substrate, tse sebelisoang ka tatellano ho hlokomela tjheseletsa lipakeng tsa chip, sekoaelo sa khalase (lense) le substrate ea ceramic.Bakeng sa flip chip, mokhoa oa Gold Tin eutectic hangata o sebelisoa ho lemoha ho tiea ha chip.Bakeng sa lichifi tse tšekaletseng le tse theohileng, sekhomaretsi sa silevera se tsamaisang le sekhomaretsi sa solder se se nang lead se ka sebelisoa ho phethela ho tiisa chip.Ha ho bapisoa le sekhomaretsi sa silevera le sekontiri sa solder e se nang lead, matla a bonding oa Gold Tin eutectic a phahame, boleng ba sebopeho se setle, 'me conductivity ea mocheso ea lera la bonding e phahame, e fokotsang ho hanyetsa mocheso oa LED.Letlapa la sekoaelo sa khalase le cheselitsoe ka mor'a ho tiea ha chip, kahoo mocheso oa tjheseletsa o fokotsoa ke mocheso oa ho hanyetsa oa lera la ho tiisa chip, haholo-holo ho kenyelletsa ho kopanya ka ho toba le ho kopanya solder.Ho kopanya ka ho toba ha ho hloke lisebelisoa tsa ho kopanya tse bohareng.Mocheso o phahameng le mokhoa oa khatello e phahameng o sebelisoa ho tlatsa ka ho toba tjheseletsa pakeng tsa sekoahelo sa khalase le substrate ea ceramic.Khokahano ea tlamahano e bataletse ebile e na le matla a phahameng, empa e na le litlhoko tse phahameng tsa lisebelisoa le taolo ea ts'ebetso;Solder bonding e sebelisa solder ea thini e nang le mocheso o tlase e le lera le bohareng.Tlas'a boemo ba ho futhumatsa le khatello, tlamahano e phethoa ka ho arohana ha liathomo pakeng tsa lera la solder le lera la tšepe.Mocheso oa ts'ebetso o tlase mme ts'ebetso e bonolo.Hajoale, bonding ea solder hangata e sebelisoa ho fumana maqhama a tšepahalang lipakeng tsa sekoaelo sa khalase le substrate ea ceramic.Leha ho le joalo, likarolo tsa tšepe li lokela ho lokisoa ka holim'a khalase ea sekoahelo sa khalase le substrate ea ceramic ka nako e le 'ngoe ho finyella litlhoko tsa tšepe ea tšepe, le khetho ea solder, ho roala ka solder, ho phalla ha solder le mocheso oa tjheseletsa ho hlokahala hore ho nahanoe ka mokhoa oa ho kopanya. .

Lilemong tsa morao tjena, bafuputsi ba lapeng le kantle ho naha ba entse lipatlisiso tse tebileng mabapi le lisebelisoa tse tebileng tsa ho paka tsa UV, tse ntlafalitseng ts'ebetso e khanyang le ts'epahalo ea leseli le tebileng la UV ho latela pono ea theknoloji ea thepa ea ho paka, le ho khothaletsa nts'etsopele ea UV e tebileng. Theknoloji ea LED.